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Semiconductor Components Industries, LLC, 2012
May, 2012 ?
Rev. 4
1
Publication Order Number:
NSD914XV2T1/D
NSD914XV2T1
High-Speed
Switching Diode
Features
?
High?Speed Switching Applications
?
Lead Finish: 100% Matte Sn (Tin)
?
Qualified Maximum Reflow Temperature: 260°C
?
Extremely Small SOD?523 Package
?
Pb?Free Package is Available
MAXIMUM RATINGS (TA
= 25
°C)
Rating
Symbol
Max
Unit
Reverse Voltage
VR
100
V
Forward Current
IF
200
mAdc
Peak Forward Surge Current
IFM(surge)
500
mAdc
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
THERMAL CHARACTERISTICS
Characteristic
Symbol
Max
Unit
Total Device Dissipation FR?5 Board (Note 1)
TA
= 25
°C
Derate above 25°C
PD
200
1.57
mW
mW/°C
Thermal Resistance Junction-to-Ambient
RJA
635
°C/W
Junction and Storage Temperature Range
TJ, Tstg
?55 to
150
°C
1. FR?4 @ Minimum Pad.
Characteristic
Symbol
Min
Max
Unit
OFF CHARACTERISTICS
Reverse Breakdown Voltage
(IBR
= 100
Adc)
V(BR)
100
?
Vdc
Reverse Voltage Leakage Current
(VR
= 20 Vdc)
(VR
= 75 Vdc)
IR
?
?
25
5.0
nAdc
Adc
Diode Capacitance
(VR
= 0 V, f = 1.0 MHz)
CD
?
4.0
pF
Forward Voltage
(IF
= 10 mAdc)
VF
?
1.0
Vdc
Reverse Recovery Time
(IF
= I
R
= 10 mAdc)
trr
?
4.0
ns
http://onsemi.com
1
CATHODE
2
ANODE
Device Package Shipping?
ORDERING INFORMATION
NSD914XV2T1 SOD?523 3000/Tape & Reel
SOD?523
CASE 502
PLASTIC
5D = Specific Device Code
M = Date Code
= Pb?Free Package
(Note: Microdot may be in either location)
MARKING
DIAGRAM
1
2
5D M
12
?For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
NSD914XV2T1G SOD?523
(Pb?Free)
3000/Tape & Reel
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